Eletroplate the technology uncovers secret greatly

Introduction
Eletroplating is a kind of technology that we often want to be involved in program middling, through the processing of this kind of technology we can get the action of colour and lustre of a few metals normally, be like Gao Guang, inferior light, through different action collocation, can form the otherness of the action of commodity, the program that is commodity and sell add a window, now metal also begin to trying to eletroplate technology, already sought different action, this article is brief introduce report (water) plating technology;

One, is what to eletroplate?

Eletroplating is to point to in contain beforehand the salt of plating metal kind in solution, with by plating base metal is cathode, the course electroanalysises action, make plating fluid medium beforehand the cation of plating metal comes out in accumulation of base metal appearance, a kind of appearance that makes film machines method.

2, eletroplating action

Eletroplate principal have the following effect:
1. anticorrosion
2. defends decorate
3. is fought wear away
4.. report function: According to the spare parts exercise requests, the film of supply electric conduction or insulation function
5.. technology requests

3, eletroplating classification

Raw material of metal of basis place plating can be divided for galvanization, copper facing, aureate etc, basis technology can divide it is a few kinds as follows:
Evaporate plating: Outside and adherent
Splash plating: Appearance communication
Water plating: Molecular connection
Evaporate plating and splashing plating is to choose fall in vacuum condition, pass distillation or splash shoot wait for a method to be in model outside accumulation all sorts of metals and metalloid film, through so the method can get very thin outside film, have speed to add the outstanding good point with good put forth effort quickly together, but quoted price is higher also, the metallic kind that can have operating is less; Normally we say eletroplating is plating pointing to water, what this article introduces is principal also the concerned common sense that is water plating;

4, eletroplating technical flow

Through so process hind is plastic electric film normally principal form by the following:

5, the influence eletroplates the crucial essential factor of action

Eletroplate action is first suffer effects of following a few element:

Advocate saline system: Each plating is planted metropolis development goes a variety of advocate saline system and the additive system that cover suitably to it, each system has his actor drawback;
Additive
Additive includes burnish agent, stabilizing agent, softening agent, damp agent, small area walks along an agent to wait. Apply different the additive that the manufacturer makes, earning film has on quality very big different;
Eletroplate equipment
Eletroplate in equipment principal include hanger, blend equipment, power source, quadrate hanger and collaboration of quadrate plating chamfer are applied, circular hanger and collaboration of circular plating chamfer are applied. Circular plating chamfer and hanger more be helpful for ensuring electric current is dispersed and even; Blend device to be able to boost solution activity, make solution state dispersed and even, eliminate bleb to linger outsidely in workpiece. Direct current source, stability is good, moire coefficient is small. These a few kinds choose the outside action that metropolis influence commodity comes out finally;
Technical parameter
Technical parameter is principal include temperature, plating fluid PH is worth, plating fluid composition, these a few parameter want to be checked by the request, do not amount to a request to want to be adjusted at once, otherwise affirmative meeting affects commodity quality;

6, eletroplate a concerned program request
1. base material is optimal choose ABS material, the adherent strength of the laminating after ABS eletroplates is better, a quoted price is comparative also and low.
2. model outside quality is sure it is very good to want, eletroplate a few weakness that cannot mask inject, and can make these weakness more apparent normally
When does 3. also want to take an appearance seriously to want to agree with from time to tome in tectonic program eletroplate processing:
Raised and optimal control is in 1) appearance 0.1~0.15mm/cm, do not have cuting limit as far as possible.
If 2) has the program of blind aperture, the deepness of blind aperture is optimal the in part that does not exceed bore diameter, the colour and lustre that holds the position of the floor that does not want pair of opening makes a request.
3) should choose suitable wall thick avoid to be out of shape, optimal it is under 1.5mm above 4mm, if demand is made very light sentence, strengthened construction should be made come to those who eletroplate ensure in corresponding azimuth be out of shape inside the limits that can accuse.
4) should consider in the program eletroplate technical demand, arrive in 60 degrees normally because of eletroplating work requirement below 70 degrees temperature limits, below the condition that hangs in condole, construction is unreasonable, metabolic happening avoids hard, be in so model want to take seriously to the azimuth of water mouth in the program, want to have the position that appropriate condole hangs together, the to having a request appearance when avoiding to be hanged in condole brings loss, the program that pursues as follows, square aperture of the center plans technically to use condole to hang.
5) is additional and optimal do not be in model in metallic insert exists, because both coefficient of expansion is different, when temperature increases, eletroplate fluid comprehends ooze to arrive in aperture, to model construction forms sure influence.




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